<\/p>\n\u00c7ok katmanl\u0131 bir ba\u011flant\u0131 modeli olu\u015fturmak i\u00e7in herhangi bir PCB’nin vize gerekir Ge\u00e7i\u015f delikleri genellikle elektrik sinyallerini iletmek i\u00e7in farkl\u0131 malzemelerle kapl\u0131d\u0131r ve s\u00fcre\u00e7 s\u0131ras\u0131nda \u0131s\u0131t\u0131c\u0131lar\u0131 al\u0131r<\/p>\n
Biliyor musunuz, delikleri bak\u0131r ile kaplayabilirsiniz ve onlar\u0131 daha iletken bir topluluk yapabilirsiniz \u00c7ad\u0131rlar ve t\u0131kanma teknolojileri aras\u0131ndaki fark\u0131 biliyor musun<\/p>\n
B\u00fct\u00fcn sorular\u0131n\u0131z\u0131 yan\u0131tlamak i\u00e7in kullan\u0131\u015fl\u0131 bir k\u0131lavuz haz\u0131rlad\u0131k Tart\u0131\u015fmalar\u0131m\u0131z delikleri doldurmak i\u00e7in kullan\u0131lan \u00e7e\u015fitli i\u015flemleri ve her i\u015flemin avantajlar\u0131n\u0131 kapsayacakt\u0131r<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
A\u015f\u0131r\u0131 deli\u011fin boyutlar\u0131 dikkate al\u0131namaz ancak bunlar bas\u0131l\u0131 devre kartlar\u0131n\u0131n (PCB) anahtar par\u00e7alar\u0131d\u0131r \u00c7ok katmanl\u0131 PCB katmanlar\u0131ndaki bak\u0131r kablolar\u0131 birbirine ba\u011flar<\/p>\n
\u00c7e\u015fitli t\u00fcrden delikler vard\u0131r, PCB \u00fczerinde delik a\u00e7mak t\u00fcm t\u00fcr a\u011f\u0131r a\u011f\u0131rl\u0131klar\u0131 olu\u015fturur Vize deli\u011finden hi\u00e7bir par\u00e7a bulamazs\u0131n\u0131z<\/p>\n
visa \u00e7ad\u0131r \u015feklinde olabilir veya a\u00e7\u0131\u011fa \u00e7\u0131kabilir-\u00e7ad\u0131r \u015feklindeki ge\u00e7i\u015f delikleri, \u00e7ad\u0131r veya deri \u015feklinde kaynak maskeleri kullan\u0131ld\u0131\u011f\u0131n30<\/p>\n
\u0130lk ba\u015flarda, \u00fcreticiler s\u0131v\u0131 \u0131\u015f\u0131k g\u00f6r\u00fcnt\u00fcleme (LPI) maskelerini kullanarak deli\u011fi a\u015fmak zordur Ancak kuru membran\u0131n geli\u015ftirilmesiyle, bu i\u015flem daha rahat hale gelir<\/p>\n
Y\u00fckseltilmi\u015f PCB, kaynak k\u00f6pr\u00fcs\u00fc nedeniyle k\u0131sa devre yapma olas\u0131l\u0131\u011f\u0131n\u0131 azalt\u0131r Ayr\u0131ca \u00e7\u00fcr\u00fcmeye ve d\u0131\u015f fakt\u00f6rlere kar\u015f\u0131 deli\u011fi de korur<\/p>\n
SMT kayna\u011f\u0131 ile \u00e7al\u0131\u015f\u0131rken, yerin sonunda delik tasar\u0131m\u0131 yap\u0131ld\u0131\u011f\u0131nda, kabartma SMD bile\u015fenlerinin ge\u00e7i\u015fini azaltmaya yard\u0131mc\u0131 olur<\/p>\n
K\u0131sa devre d\u00f6n\u00fc\u015f\u00fc s\u0131ras\u0131nda k\u0131sa devre yapma olas\u0131l\u0131\u011f\u0131n\u0131 azaltmak i\u00e7in SMT kayna\u011f\u0131n\u0131n yak\u0131n\u0131ndaki delikler i\u00e7in Bazen a\u00e7\u0131l\u0131\u015f deli\u011fi tekrar bir kaynak membran\u0131 taraf\u0131ndan yap\u0131lm\u0131\u015ft\u0131r<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
T\u0131kan\u0131kl\u0131k, ge\u00e7i\u015f deli\u011finin tamamen t\u0131kanmas\u0131n\u0131 engelleyen bir kaynak membran\u0131 veya dolgu gibi malzemelerle yap\u0131l\u0131r Daha sonra, \u00fcreticiler LPI maskelerine yap\u0131\u015ft\u0131r\u0131yorlar<\/p>\n
Bu t\u0131kan\u0131kl\u0131k i\u015flemi alt\u0131nda, t\u0131kan\u0131kl\u0131k t\u00fcp\u00fc hi\u00e7bir y\u00fczey temizli\u011fi elde etmez Vizelerinin tamamen test edildi\u011finden emin olmak i\u00e7in delikleri dolduruyorlar<\/p>\n
\u00dcretim s\u0131ras\u0131nda a\u011f\u0131rl\u0131klar\u0131 engellemek i\u00e7in ek ad\u0131mlar uygulaman\u0131z gerekir Ge\u00e7i\u015f deliklerinin boyutlar\u0131n\u0131 g\u00f6z \u00f6n\u00fcnde bulundurmal\u0131s\u0131n\u0131z ve ge\u00e7i\u015f deliklerinin hi\u00e7bir y\u00fczey temizli\u011fi yoktur<\/p>\n
Ayr\u0131ca sertle\u015fme s\u0131ras\u0131nda b\u00fct\u00fcn u\u00e7an maddeleri n\u00f6tralize etmek i\u00e7in y\u00fckselme h\u0131z\u0131n\u0131 kontrol etmelisiniz Y\u00fckselmeyi kontrol edemiyorsan\u0131z, ak\u0131\u015f ak\u0131\u015f\u0131n\u0131 birle\u015ftirme s\u0131ras\u0131nda bir kaynak zar\u0131 y\u00fczeye uygulanabilir<\/p>\n
Ge\u00e7i\u015f deli\u011fi iletken ve iletken olmayan dolgularla bardaklar\u0131 engelleyebilir Kablolu olmayan epoksit malzemeleri veya kaynakl\u0131 membranlar\u0131 kullanarak deliklerin ve yuvarlak d\u00f6ng\u00fclerin tamamen kaplanmas\u0131n\u0131 sa\u011flayabilirsiniz Bu, BGA SMD kayna\u011f\u0131nda k\u00f6t\u00fc veya sa\u011flamla\u015ft\u0131r\u0131lm\u0131\u015f ba\u011flant\u0131 noktalar\u0131 olu\u015fturmayaca\u011f\u0131n\u0131zdan emin olur<\/p>\n
\u015eu anda BGA paketleri daha da s\u0131k\u0131la\u015f\u0131yor Sinyali d\u0131\u015f katmana g\u00f6ndermek i\u00e7in standart k\u00f6pek kemi\u011fi desenini kullanmak zordur<\/p>\n
Dolay\u0131s\u0131yla, BGA paketindeki kaynak taban\u0131na delikler yerle\u015ftirilir ve sinyalleri kolayca y\u00f6nlendirmenizi sa\u011flar<\/p>\n
Bu i\u015flem i\u00e7in, deli\u011fin tamamen t\u0131kanmas\u0131 gerekir Daha sonra, t\u0131kan\u0131kl\u0131k delikleri bak\u0131r kaplanm\u0131\u015f ve di\u011fer bak\u0131r \u00f6zellikleriyle kar\u015f\u0131la\u015ft\u0131r\u0131lm\u0131\u015ft\u0131r<\/p>\n
PCB \u00fczerindeki baz\u0131 y\u00fczey tak\u0131mlar\u0131 \u00e7ok fazla \u0131s\u0131 \u00fcretir ve d\u00fczg\u00fcn \u00e7al\u0131\u015fmas\u0131 i\u00e7in bunu iletmek zorundad\u0131r Bu nedenle \u0131s\u0131 yollar\u0131 genellikle iletken dolgularla t\u0131kan\u0131r<\/p>\n
Dolgular metaldir ve devrenin di\u011fer taraf\u0131na \u0131s\u0131 aktar\u0131r Bu dolgu ayn\u0131 zamanda kablolar\u0131n direncini azalt\u0131r ve b\u00fcy\u00fck miktarda elektrik ta\u015f\u0131yan \u00e7iplere uygulan\u0131r<\/p>\n
Bu da SMD ile voltaj kayna\u011f\u0131 ayaklar\u0131 aras\u0131ndaki bas\u0131nc\u0131 azalt\u0131r<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Ge\u00e7i\u015f deli\u011fi, ge\u00e7i\u015f deli\u011fini kapatmak i\u00e7in bir kaynak membran\u0131 kullan\u0131r \u0130pek boyama, sprey ve perde boyama gibi farkl\u0131 perde programlar\u0131 kullan\u0131labilir<\/p>\n
Ancak bu yakla\u015f\u0131mlar deliklerin tamam\u0131n\u0131 a\u00e7mak i\u00e7in yeterli de\u011fildir \u00d6rne\u011fin, p\u00fcsk\u00fcrtme ve belirli stratejiler her iki taraf\u0131 da a\u00e7\u0131k deli\u011fi sarmak i\u00e7in yeterli de\u011fildir<\/p>\n
\u0130pek kaplama i\u015flemi deliklerin boyutlar\u0131n\u0131 ve kal\u0131nl\u0131\u011f\u0131n\u0131 k\u0131s\u0131tlar<\/p>\n
BGA tasar\u0131m\u0131 gibi bir\u00e7ok durumda, t\u0131kan\u0131kl\u0131k deli\u011fi genellikle SMD kayna\u011f\u0131na \u00e7ok yak\u0131n oldu\u011fundan yararl\u0131d\u0131r Bu durumda, t\u0131kanm\u0131\u015f delikler sorunu \u00e7\u00f6zer<\/p>\n
\u00dcretim s\u0131ras\u0131nda, gizlenmi\u015f t\u0131kan\u0131kl\u0131klar\u0131n veya iletilmeyen dolgular\u0131n tam bir m\u00fch\u00fcr olu\u015fturulmas\u0131n\u0131 sa\u011flay\u0131n Bu i\u015flem, ge\u00e7i\u015f deliklerinin% 100 geni\u015flemesini ve doldurulmas\u0131n\u0131 sa\u011flar<\/p>\n
S\u0131k\u0131\u015ft\u0131r\u0131ld\u0131\u011f\u0131nda ilk olarak maske bo\u015flu\u011funu \u00e7\u0131kar\u0131n Daha sonra PCB tasar\u0131m parametrelerine g\u00f6re delikleri doldurur<\/p>\n
IPC taraf\u0131ndan geli\u015ftirilen standartlara dayal\u0131 ge\u00e7i\u015f delikleri t\u0131kan\u0131kl\u0131\u011f\u0131<\/p>\n
\u0130lk ge\u00e7i\u015f deste\u011fi ve t\u0131kanma kavram\u0131n\u0131 biliyorsun Bir sonraki b\u00f6l\u00fcmde kaynaklar\u0131 doldurmakla ilgili daha fazla konu\u015faca\u011f\u0131z<\/p>\n
\u00a0<\/p>\n
<\/p>\n
\u015eekil 1 Ge\u00e7i\u015f deli\u011fi<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Ge\u00e7i\u015f sinyali devrenin bir taraf\u0131ndan di\u011fer taraf\u0131na aktar\u0131l\u0131yor \u00dcreticiler, elektrik ak\u0131m\u0131n\u0131 sa\u011flamak i\u00e7in PCB’ye bak\u0131r katmanlar boyarlar ve deliklerle ba\u011flant\u0131l\u0131 katmanlar aras\u0131nda bir ba\u011flant\u0131 kurarlar<\/p>\n
Bak\u0131r, elektrik sinyallerini iletmek i\u00e7in yeterlidir ancak \u00fcreticiler kapasiteyi art\u0131rmak i\u00e7in bo\u015fluklar\u0131 ba\u015fka bir iletken madde kullanabilirler<\/p>\n
Bak\u0131r devre kart\u0131n\u0131n termal iletkenli\u011fini art\u0131r\u0131r, hassas PCB bile\u015fenlerinden \u0131s\u0131y\u0131 al\u0131r ve devrenin di\u011fer taraf\u0131na yay\u0131l\u0131r Hatalar olu\u015fturma \u015fans\u0131n\u0131 azalt\u0131r ve PCB’nin \u00f6mr\u00fcn\u00fc uzat\u0131r<\/p>\n
Bak\u0131r deli\u011fi de devre kart\u0131n\u0131n bir taraf\u0131ndan di\u011fer taraf\u0131na ak\u0131m gerektiren uygulamalar i\u00e7in m\u00fckemmel<\/p>\n
Bak\u0131r iletken \u00f6zellikleri, PCB’ye bask\u0131 yapmadan y\u00fcksek ak\u0131m sinyallerinin ge\u00e7mesini sa\u011flar Bu da bak\u0131r alan\u0131n\u0131n y\u00fcksek bas\u0131n\u00e7l\u0131 uygulamalara uygun olmas\u0131n\u0131 sa\u011flar<\/p>\n
Bak\u0131r delikler \u00fcretim maliyetlerini art\u0131r\u0131r ancak y\u00fcksek kararl\u0131l\u0131k gerektirdi\u011finde bu gereklidir<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Elektrikli olarak doldurulmu\u015f delikler metalden yap\u0131lm\u0131\u015ft\u0131r ve \u0131s\u0131t\u0131c\u0131lar\u0131 etkili bir \u015fekilde \u0131s\u0131t\u0131r Devre kart\u0131n\u0131n di\u011fer taraf\u0131na b\u00fcy\u00fck miktarda elektrik veya \u0131s\u0131 aktar\u0131ld\u0131\u011f\u0131nda delikleri doldurmak i\u00e7in kullan\u0131l\u0131r<\/p>\n
Elektrikli dolgular, \u00e7ipin alt\u0131nda \u00e7ok fazla \u0131s\u0131 gerektiren ko\u015fullar i\u00e7in idealdir<\/p>\n
Bu i\u015flem, iletken dolgular ve \u00e7evresindeki y\u0131\u011f\u0131nlar aras\u0131ndaki termal \u0131s\u0131nma fakt\u00f6r\u00fc (CTE) farkl\u0131 bir kusuru ortaya \u00e7\u0131kar\u0131r<\/p>\n
\u00c7evresindeki katman bas\u0131nc\u0131ndan daha h\u0131zl\u0131 \u015fi\u015firdi\u011finden, duvarlar ve yast\u0131klar ortas\u0131nda \u00e7atlar<\/p>\n
Bu nedenle bu i\u015flem, delikleri kaplayan bak\u0131r kaplaman\u0131n dayan\u0131kl\u0131l\u0131\u011f\u0131n\u0131 sa\u011flamak i\u00e7in kaynak tabakas\u0131ndaki delikler gibi baz\u0131 uygulamalar i\u00e7in uygun de\u011fildir<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
\u00c7o\u011fu insan, iletken dolgularla doldurulmu\u015f deliklerin bir taraftan di\u011ferine k\u00fc\u00e7\u00fck bir elektrik sinyali aktaramayaca\u011f\u0131n\u0131 d\u00fc\u015f\u00fcn\u00fcyor<\/p>\n
Ama bu i\u015fe yaramad\u0131 \u00e7\u00fcnk\u00fc t\u00fcm delikler bak\u0131r kaplanm\u0131\u015ft\u0131 ve bak\u0131r iletken \u00f6zelliklere sahipti<\/p>\n
Sadece elektrik ak\u0131m\u0131 olmayan dolgular f\u0131\u00e7\u0131lar\u0131n atmosferini de\u011fi\u015ftiriyor<\/p>\n
Kaynak veya di\u011fer kirlili\u011fin deliklere girmenizi engellemeyece\u011finden emin olmak i\u00e7in bu i\u015flemi kullanabilirsiniz Ayr\u0131ca ge\u00e7i\u015f deliklerindeki bak\u0131r kaynakl\u0131 tabaklar i\u00e7in yap\u0131sal destek sa\u011flamak i\u00e7in de uygundur<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Ge\u00e7i\u015fler bir\u00e7ok malzemeyi kaplayabilir; kaynak membranlar\u0131 en yayg\u0131n t\u00fcrdendir Kaynak maskesi, kaynak maskesi taraf\u0131ndan kapat\u0131lm\u0131\u015f ge\u00e7i\u015f delikleri ve bir u\u00e7ta a\u00e7\u0131k ge\u00e7i\u015f delikleri gibi deliklere \u00e7e\u015fitli \u015fekillerde uygulanabilir<\/p>\n
Bazen deliklerin her iki taraf\u0131 da a\u00e7\u0131kt\u0131r \u0130htiyac\u0131n\u0131z olan anotlanma t\u00fcr\u00fc uygulanan \u00f6zelliklere ve amac\u0131n\u0131za ba\u011fl\u0131d\u0131r<\/p>\n
Birle\u015ftirme i\u015flemi s\u0131ras\u0131nda deli\u011fin \u00fczerine bir kaynak band\u0131 uygulayabilirsiniz \u00d6nce devre kart\u0131n\u0131n tamam\u0131n\u0131 kaynakl\u0131 m\u00fcrekkeplerle boyay\u0131n ve kurutun<\/p>\n
Ultraviyole \u0131\u015f\u0131\u011f\u0131na maruz kald\u0131r\u0131ld\u0131\u011f\u0131ndan m\u00fcrekkep, ultraviyole duyarl\u0131 oldu\u011fundan sertle\u015febilir<\/p>\n
Tasar\u0131m kurallar\u0131na g\u00f6re baz\u0131 m\u00fcrekkep par\u00e7alar\u0131 ultraviyole \u0131\u015f\u0131\u011f\u0131na maruz kalmaz Yumu\u015fak kal\u0131rlar. Y\u00fczde 1 alkalik \u00e7\u00f6z\u00fcm\u00fcn kullan\u0131lmas\u0131n\u0131 sa\u011flayabilirsiniz<\/p>\n
\u00a0<\/p>\n
<\/p>\n
\u015eekil 2: \u00c7ad\u0131r ge\u00e7idi<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Eski miras\u0131 ve askeri ekipmanlar\u0131 doldurman\u0131n bir yolunu bulabilirsiniz Bak\u0131r anotlanm\u0131\u015f deliklerle iletken dolgular sa\u011flan\u0131r ve iletken dolgular\u0131 kullanmaktan daha g\u00fcvenilir hale getirir ve panellere uygular<\/p>\n
Bak\u0131r dolgular ayn\u0131 zamanda g\u00fc\u00e7l\u00fc bir \u00e7ekirdek olu\u015fturmaya da yard\u0131mc\u0131 olur Anotlanm\u0131\u015f delikler i\u00e7in d\u00fcz bir y\u00fczey de elde edebilirsiniz, b\u00f6ylece y\u00fcksek kaliteli \u00fcr\u00fcn bile\u015fenleri olu\u015fturabilirsiniz Bu i\u015flem ayr\u0131ca kayna\u011f\u0131n da\u011f\u0131lmas\u0131n\u0131 ve montaj d\u00fczeyindeki tela\u015f kesicilerini etkilemesini \u00f6nler<\/p>\n
Bu s\u00fcrecin baz\u0131 k\u0131s\u0131tlamalar\u0131 var b\u00fct\u00fcn f\u0131\u00e7\u0131lar\u0131 elektrotla\u015ft\u0131rmak \u00e7ok zor olacakt\u0131r<\/p>\n
\u00dcst ve alt delikler daha h\u0131zl\u0131 kaplan\u0131r ve baz\u0131 hava veya s\u0131v\u0131lar ortada tutulabilir<\/p>\n
Bronzla\u015ft\u0131r\u0131lm\u0131\u015f delikler i\u00e7in \u00e7ok k\u00fc\u00e7\u00fck olmal\u0131 Bo\u015fluklar\u0131 doldurmak i\u00e7in kullan\u0131lan bak\u0131r da devre kart\u0131ndaki t\u00fcm bak\u0131r bile\u015fenleri kaplar, b\u00f6ylece toplam bak\u0131r miktar\u0131n\u0131 art\u0131r\u0131r Size bir \u00f6rnek vereyim<\/p>\n
Biliyor musun, 1 gram bak\u0131r, 1.4 milt bir b\u00f6cek gibidir 8 mil deli\u011fi doldurmak i\u00e7in gereken bak\u0131r miktar\u0131 2,8 gramd\u0131r Silah\u0131n her iki taraf\u0131nda kaplama vard\u0131r, bu nedenle 8 mil\/2 veya 4 kal\u0131nl\u0131ktad\u0131r<\/p>\n
\u015eimdi, y\u00fcr\u00fcy\u00fc\u015f ve delik gibi mevcut bak\u0131r i\u015flevlerine k\u0131yasla 4 miles\/ 1,4 veya 2,85 uncu fazladan bak\u0131r miktar\u0131 olacakt\u0131r<\/p>\n
Bak\u0131r\u0131n toplam a\u011f\u0131rl\u0131\u011f\u0131 2,3 ila 4 uncu aras\u0131ndad\u0131r. Bu, boyutlar\u0131n\u0131 k\u0131s\u0131tlayan devre kartlar\u0131 i\u00e7in \u00e7ok fazla b\u00fcy\u00fck<\/p>\n
Art\u0131k Eagle’da daha iyi PCB yap\u0131m\u0131n\u0131 nas\u0131l yapaca\u011f\u0131m\u0131z\u0131 \u00f6\u011frenece\u011fiz<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Kablo geni\u015fli\u011fi PCB tasar\u0131m\u0131nda \u00f6nemli bir \u00f6nem ta\u015f\u0131r ve s\u0131cak ve zarar g\u00f6rmeden ge\u00e7ebilece\u011finiz ak\u0131m miktar\u0131n\u0131 belirler<\/p>\n
Geni\u015fli\u011fi de\u011fi\u015ftirerek ve DRC kural\u0131ndaki y\u00fcr\u00fcy\u00fc\u015f geni\u015fli\u011fine eri\u015ferek Eagle PCB tasar\u0131m\u0131nda farkl\u0131 y\u00fcr\u00fcy\u00fc\u015f \u00e7izgisi geni\u015fli\u011f<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Eagle’da varsay\u0131lan a\u015f\u0131r\u0131 delik boyutu 0,6 mm’dir \u00d6\u011felerin ve uygulamalar\u0131n gereksinimlerine g\u00f6re b\u00fcy\u00fckl\u00fc\u011f\u00fc de\u011fi\u015ftirebilirsiniz<\/p>\n
\u00a0<\/p>\n
<\/p>\n
\u015eekil 3 Ge\u00e7i\u015f deli\u011fi<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Eagle yaz\u0131l\u0131m\u0131ndaki tasar\u0131m kurallar\u0131 PCB tasar\u0131m\u0131n\u0131n de\u011ferlerini ve parametrelerini ayarlaman\u0131z\u0131 sa\u011flar \u00d6rne\u011fin, bir katman\u0131n y\u00fcr\u00fcy\u00fc\u015f \u00e7izgisi geni\u015fli\u011fini, ge\u00e7i\u015f deliklerini ve kaynak taban\u0131n\u0131n boyutlar\u0131n\u0131 se\u00e7ebilirsiniz Uygun oldu\u011funu d\u00fc\u015f\u00fcnd\u00fc\u011f\u00fcn\u00fcz tasar\u0131m kurallar\u0131n\u0131 d\u00fczenleyebilirsiniz<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Eagle Tasar\u0131m Kurallar\u0131 Denetimi, PCB tasar\u0131m\u0131n\u0131z\u0131 \u00fcretim s\u00fcrecinin fiziksel k\u0131s\u0131tlamalar\u0131na g\u00f6re do\u011frulaman\u0131z\u0131 sa\u011flar<\/p>\n
Bile\u015fen bo\u015flu\u011fu, y\u00fcr\u00fcy\u00fc\u015f \u00e7izgisi geni\u015fli\u011fiyle ilgili bir dizi s\u0131n\u0131r ayarlayabilir ve t\u00fcm tasar\u0131m \u00f6zelliklerinin gereksinimlerini kar\u015f\u0131lamas30<\/p>\n
Eagle Denetim Masas\u0131nda DRC arac\u0131n\u0131 bulabilirsiniz<\/p>\n
A\u015fa\u011f\u0131daki b\u00f6l\u00fcmde, a\u015f\u0131r\u0131 deli\u011fin avantajlar\u0131 ve zay\u0131fl\u0131klar\u0131 a\u00e7\u0131klanmaktad\u0131r<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Kaplanmam\u0131\u015f ge\u00e7i\u015f delikleri yuvarlak halkalarda ve ge\u00e7i\u015f t\u00fcp\u00fcnde kaynak maskesi yoktur Standart PCB \u00fcretim i\u015flemi yaln\u0131zca delikler i\u00e7in y\u00fczeysel cilalama malzemelerini uygulamakt\u0131r<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Bu i\u015flem y\u00fcksek ak\u0131ml\u0131 kablolar i\u00e7in idealdir ve \u0131s\u0131 \u0131s\u0131t\u0131c\u0131lar\u0131n\u0131 etkili hale getirir Ayn\u0131 zamanda kaynakl\u0131 uygulamalar i\u00e7in kaynakl\u0131<\/p>\n
Ge\u00e7i\u015f delikleri \u00e7\u0131plak oldu\u011fundan, devrenin her iki taraf\u0131na eri\u015ferek harici testler yapabilirsiniz<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Deli\u011fin a\u00e7\u0131\u011fa \u00e7\u0131kmas\u0131 bir s\u00fcr\u00fc zay\u0131fl\u0131\u011fa neden olabilir \u00c7evreye maruz kald\u0131\u011f\u0131n\u0131z i\u00e7in \u00e7\u00fcr\u00fcm\u00fc\u015f ve zarar g\u00f6rm\u00fc\u015f<\/p>\n
Di\u011fer y\u00fczeylerle de temasa ge\u00e7ebilirler ve k\u0131sa devre riskini art\u0131rabilirler<\/p>\n
Kaynak ba\u011flant\u0131s\u0131 s\u0131ras\u0131nda erimi\u015f kaynak deliklerden ak\u0131yor ve kaynak toplar\u0131n\u0131 ve s\u0131\u00e7ramalar\u0131n\u0131 olu\u015fturuyor<\/p>\n
PCB’yi temizlemek i\u00e7in kullan\u0131lan baz\u0131 malzemeler de \u00e7\u0131plak deliklere tak\u0131l\u0131r<\/p>\n
Vizeler test s\u0131ras\u0131nda hasar g\u00f6rm\u00fc\u015f olabilir<\/p>\n
\u015eimdi, Pad’deki a\u015f\u0131r\u0131 deli\u011fe bakal\u0131m<\/p>\n
\u00a0<\/p>\n
<\/p>\n
\u015eekil 4 Ge\u00e7i\u015f deli\u011fi<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
PCB ve BGA (Top Gate Array) k\u00fc\u00e7\u00fcl\u00fcyor ve kaynak teknolojisinde a\u015f\u0131r\u0131 deli\u011fin \u00f6nemini art\u0131r\u0131yor<\/p>\n
Bu teknoloji BGA paketinden sinyal aktar\u0131rken geleneksel” k\u00f6pek kemi\u011fi kaynakl\u0131 kaynak modunu kullanmaz ve BGA paketi sinyali ba\u015fka bir katmana g\u00f6nderir Bunun yerine, a\u015f\u0131r\u0131 delikler do\u011frudan BGA paketi kaynak taba\u011f\u0131na girer<\/p>\n
Kaynak tabakas\u0131ndaki ge\u00e7i\u015f delikleri, kesinli\u011fi art\u0131rarak ge\u00e7i\u015f deliklerinden veya k\u00f6r deliklerden daha iyi avantajlar sa\u011flar Ayr\u0131ca daha y\u00fcksek yo\u011funluklu PCB \u00e7ubuklar\u0131 olu\u015fturdu\u011fundan yer tasarrufu sa\u011flayabilirsiniz<\/p>\n
Kaynaktaki delikler de daha iyi \u0131s\u0131 y\u00f6netimi i\u00e7in yer a\u00e7ar Ayr\u0131ca PCB alan\u0131n\u0131 azalt\u0131r ve di\u011fer bile\u015fenler i\u00e7in d\u00fcz bir y\u00fczey tutar<\/p>\n
Tart\u0131\u015fmam\u0131z neredeyse bitti Bitirmeden \u00f6nce, eklentilerden birine bakal\u0131m<\/p>\n
\u00a0<\/p>\n
<\/p>\n
\u015eekil 5 Ge\u00e7i\u015f deli\u011fi<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
PCB’nin farkl\u0131 katmanlar\u0131na ba\u011fl\u0131 delikleri tamamen kaplad\u0131\u011f\u0131n\u0131zda, ge\u00e7i\u015f t\u0131kan\u0131kl\u0131\u011f\u0131 gereklidir Genellikle iletilmeyen dolgular, kaynak maskeleri gibi ge\u00e7i\u015f deliklerini kolayla\u015ft\u0131r\u0131r<\/p>\n
Ayr\u0131ca bak\u0131r gibi iletken dolgular\u0131 kullanarak devre kartlar\u0131n\u0131n iletkenli\u011fini art\u0131rabilirsiniz \u00c7ember, t\u00fcm varilleri m\u00fch\u00fcrlemek i\u00e7in kullan\u0131lan du\u015flarla kapl\u0131d\u0131r<\/p>\n
Em\u00fclsiyon kaplamas\u0131 bak\u0131r izleri \u00e7\u00fcr\u00fcmeye, oksitlenmeye ve kaynak k\u00f6pr\u00fclerine kar\u015f\u0131 korur<\/p>\n
Elektrik k\u0131sa devrelerine ve fiziksel hasarlara daha da dayan\u0131kl\u0131lar BGA tasar\u0131m\u0131 gibi alan s\u0131n\u0131rl\u0131 uygulamalar i\u00e7in a\u015f\u0131r\u0131 deli\u011fi takmak \u00e7ok \u00f6nemlidir<\/p>\n
\u00a0<\/p>\n
<\/p>\n
\u015eekil 6 Ge\u00e7i\u015f deli\u011fi<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n
Bir\u00e7ok \u00f6nemli ama\u00e7 vard\u0131r ve PCB \u00fcretiminde standart bir i\u015f \u00e7al\u0131\u015fmas\u0131d\u0131r<\/p>\n
Elektrikli ve iletilmeyen malzemeleri kullanarak deli\u011fi tamamen a\u00e7\u0131\u011fa \u00e7\u0131karabilir veya t\u0131kand\u0131rabilirsiniz Bazen BGA, alan k\u0131s\u0131tlamalar\u0131 i\u00e7eren kaynak delikleri teknolojisini kullanarak tasarlanm\u0131\u015ft\u0131r<\/p>\n
\u00c7ad\u0131rlar ve fi\u015fler arac\u0131l\u0131\u011f\u0131yla y\u00fcksek kaliteli bas\u0131l\u0131 devre kartlar\u0131 yapabiliriz \u00dcretim teknolojimiz, sizin tasar\u0131m \u00f6zelliklerinize uygun olarak tercih etti\u011finiz kaplamalar\u0131 kullanarak ge\u00e7i\u015f a\u011f\u0131rl\u0131klar\u0131n\u0131n olu\u015fturulmas\u0131<\/p>\n
Ekibimizle ba\u011flant\u0131 kurun, y\u00fcksek standartlar\u0131m\u0131z hakk\u0131nda daha fazla bilgi edinin ve PCB toplu sipari\u015f edin<\/p>\n
\u00a0<\/p>\n
\u00a0<\/p>\n","protected":false},"excerpt":{"rendered":"
Tentingvia-PCB’nin \u00f6neminin en b\u00fcy\u00fck parma\u011f\u0131<\/p>\n","protected":false},"author":7138,"featured_media":52995,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"yoast_head":"\n