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Capabilities

WellPCB is focusing on online prototype orders, to meet the requirements for High Quality, Low Cost, Fast Delivery, Easy Ordering from customers around the world. We can accept 4 kinds of files format (gerber, .pcb, .pcbdoc or .cam file format) for PCB Prototype Manufacturing.

 

We do perform full DRC checks of all Client files and will inform you immediately if we find any problem. We then will work with you to correct the files so they are suitable for manufacturing. Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table.

Rigid pcb

We can accept 4 kinds of files format (Gerber, .pcb, .pcbdoc or .cam file format) for PCB Prototype Manufacturing. We do perform full DRC checks of all Client files and will inform you immediately if we find any problem.

We then will work with you to correct the files so they are suitable for manufacturing. Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table.

  • Layer Counts
    1-32 Layers
  • Lead Time
    Normal: 5-6 Days
    Expedited: 24-48Hours
  • Materials
    FR4, High TG FR4, Halogen Free material, CEM-3, Rogers HF material, etc.
  • Finished Copper Thickness
    0.5 - 5 OZ
  • Finished Board Thickness
    0.2 - 6.0mm
  • Min. Line/Track Width&Space
    3mil
  • Qualifications
    ISO 9001:2008, ISO14001:2004,
    ISO / TS 16949:2009
    UL Certified
  • Technology
    On-Across Blindried Vias, Characteristic Impedance Control, Rigid-flex Board etc
  • Solder Mask Color
    Green, Black, Blue, White, Red, Yellow, and Matt, etc.
  • Legend/Silkscreen Color
    White, Yellow, Black, etc.
  • Surface Treatment
    Leaded HASL, Lead Free HASL, Immersion Gold, OSP, Immersion tin, Immersion Silver, etc.
  • Wrap and Twist
    ≤0.7%
  • Other Technology
    Gold Finger, Peelable Mask, Non-across Blind-Buried vias, Characteristic Impedance Control, Rigid-Flex Board etc.

pcb ASSEMBLY

We strive to make the whole assembly process as easy as possible:

Single Point Source: No need to order bare board PCB from one supplier, solder stencil from another supplier and PCB assembly from yet another supplier.

We provide prototype promotions and also mass quantity production from one board to thousands of boards.

We offer rapid turnaround, kit service, turnkey service, harness assembly and box build service.

  • Placer Speed
    60000 Chips/Hour
  • Lead Time
    25+ Days (To Be Decided)
  • SMT
    SMT, Through Hole Assembly Single/Double-Side SMT, Single/Double-Sides Mixture Assembly
  • PCB Size
    50mm×50mm ~ 450mm×406mm
  • PCB Thickness
    0.5mm ~ 4.5mm
  • Min. Diameter / Space of BGA
    0.2mm / 0.35mm
  • Qualifications
    ISO 9001: 2008
  • Accuracy
    <±40µm, Under the Condition of 3σ, CPK≥1
  • Minimum Width / Space of QFP
    0.15mm/0.3mm, Minimum Diameter /Space of BGA: 0.2mm/0.35mm
  • Reliability Test
    Flying Probe Test/Fixture test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micor Metallographic Section Analysis, etc.

FLEX pcb

Manufacturing Capability：Conventional Capability

Ultimate Capability：Unconventional ability；Submit to review beyond these Capabilities

  • FPC Base Material(Adhesive)
    ShengyiSF302:PI=0.5 mil,1 mil,2 mil;Cu=0.5 oz,1 oz
    ShengyiSF305:PI=0.5 mil,1 mil,2 mil;Cu=0.33 oz,0.5 oz,1 oz
  • FPC Base Material(Adhesiveless)
    SongxiaRF-775/777:PI=1 mil,2 mil,3 mil;Cu=0.5 oz, 1 oz (Ultimate:PI=1 mil,2 mil,3 mil;Cu=2 oz)
    Xinyang:PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
    Taihong PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
    Dubang AP:PI=1 mil, 2 mil, 3 mil, 4 mil;Cu=0.5 oz, 1 oz (Ultimate:PI=1 mil，2 mil，3 mil，4 mil；Cu=2 oz)
  • Layers
    1-4 Layers (Ultimate:5-8 Layers)
  • Thickness of Finished Product (Flex Part，No Stiffener)
    0.05-0.5 mm (Ultimate:0.5-0.8 mm)
  • Size of Finished Products (Min)
    5 mm*10 mm (Bridgeless); 10 mm*10 mm (Bridge)
    Ultimate:4 mm*8 mm (Bridgeless); 8 mm*8 mm (Bridge)
  • Size of Finished Products (Max)
    9 inch*14 inch
    Ultimate:9 inch*23 inch (PI≥1 mil)
  • Impedance Tolerance
    Single-Ended：±5Ω(≤50Ω),±10%(＞50Ω)
    Ultimate:Single-Ended：±3Ω(≤50Ω)，±8%(＞50Ω)
  • Impedance Tolerance
    Differencial：±5Ω(≤50Ω),±10%(＞50Ω)
    Ultimate:Differencial：±4Ω(≤50Ω)，±8%(＞50Ω)
  • Tolerance of Finger Width
    ±0.1 mm (Ultimate:±0.05 mm)
  • Min Distance to the Edge of Finger
    8 mil (Ultimate:6 mil)
  • Min Distance between Pads
    4 mil (Ultimate:3 mil)
  • Minimum Laser Hole
    0.1mm
  • Minimum PTH
    0.3mm
  • Min NPTH Tolerance
    ±2 mil (Ultimate +0, -2 mil or +2 mil, -0)
  • Solder Bridge Min Width(Bottom Copper<2OZ)
    4 mil (Green), 8 mil
  • Solder Bridge Min Width(bottom copper 2-4OZ)<2OZ)
    6 mil, 8 mil
  • Overlay Colour<2OZ)
    White, Yellow (Printed Character: White)
  • Type of Surface Treatment<2OZ)
    OSP HASL, Lead Free HASL, Immersion Gold, Hard Gold, Immersion Silver, OSP
  • Selective Surface Treatment<2OZ)
    ENIG+OSP, ENIG+G/F

rigid-FLEX pcb

We serve our customers with strong technical R&D capability, various types of products, stable and quick delivery capability. We are one of the competitive companies in the domestic with the high-class level in rigid-flex board fields.

Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table.

  • Feature
    Capability
  • Material
    Polyimide Flex+FR4
  • Solder Mask Color(Rigid Part)
    Green, Red, Yellow, Blue, White, Black, Matte Black, Matte Green, Matt Blue
  • Covrelay Color (Flex Part)
    Yellow Coverlay, Brownish Yellow
  • Silkscreen Color
    White, Black, yellow
  • Via Process
    Tenting Vias,Plugged Vias,Vias not Covered
  • Max Panel Size
    406mmx736mm
  • Min Panel Size
    10mm*15mm
  • Min. Track/Spacing
    3.5mil/ 4.0mil
  • Min. Hole Size
    0.15mm
  • Rigid-Flex Thickness
    0.2-4.0mm
  • Impedance Control Tolerance
    Single-ended：±3Ω(≤50Ω)，±5%(＞50Ω)
    Differential Pair：±3Ω(≤50Ω)，±5%(＞50Ω)
  • Twist & Warp min.
    0.75%（Symmetrical）
    1.5%（Symmetrical
  • Adhesive dispense width
    1.5±0.5mm（Slot Width≥10mm）
  • Min Distance Between R-F Connect Area to Conduct
    0.3mm（Half Depth Slot Process）
    0.5mm Normal
  • Min. Width of Resin Flow Out in R-F Connect Area
    0.5mm
    1.0mm Normal
  • Max inner Layer Finished Copper Thickness
    3oz
  • Min Mechanical Drill Size
    0.15mm （<=1.6mm）
    0.2mm (<=2.5mm）
  • Min Half-Hole (pth) Size
    0.3mm
  • Laser via Size
    4mil-6mil（Advance 6mil
  • Max buried Hole Size
    0.4mm
  • Max Drill Hole Size
    6.3mm
  • Max A/R for Through Hole
    12:1
  • Max A/R for Laser Blind Hole
    0.8:1
  • Outline Tolerance
    ±0.1mm